Microfluidic chip fabrication using hot embossing and thermal bonding of COP
Author:
Funder
National Science Council of the Republic of China, Taiwan
Taipei Medical University, Taiwan
Publisher
Wiley
Subject
Polymers and Plastics
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/pat.1447/fullpdf
Reference12 articles.
1. Imprint lithography with sub-10 nm feature size and high throughput
2. Fabrication of plastic microchips by hot embossing
3. Polymer embossing tools for rapid prototyping of plastic microfluidic devices
4. Low-pressure, high-temperature thermal bonding of polymeric microfluidic devices and their applications for electrophoretic separation
5. Effects of Fabrication Process Parameters on the Properties of Cyclic Olefin Copolymer Microfluidic Devices
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