Technology and Integration Roadmap for Optoelectronic Memristor

Author:

Wang Jinyong12,Ilyas Nasir1,Ren Yujing3,Ji Yun2,Li Sifan2,Li Changcun1,Liu Fucai1,Gu Deen14,Ang Kah‐Wee25ORCID

Affiliation:

1. School of Optoelectronic Science and Engineering University of Electronic Science and Technology of China Chengdu 611731 P. R. China

2. Department of Electrical and Computer Engineering National University of Singapore Singapore 117576 Singapore

3. Department of Chemical and Biomolecular Engineering National University of Singapore Singapore 117585 Singapore

4. State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 611731 P. R. China

5. Institute of Materials Research and Engineering A*STAR Singapore 138634 Singapore

Abstract

AbstractOptoelectronic memristors (OMs) have emerged as a promising optoelectronic Neuromorphic computing paradigm, opening up new opportunities for neurosynaptic devices and optoelectronic systems. These OMs possess a range of desirable features including minimal crosstalk, high bandwidth, low power consumption, zero latency, and the ability to replicate crucial neurological functions such as vision and optical memory. By incorporating large‐scale parallel synaptic structures, OMs are anticipated to greatly enhance high‐performance and low‐power in‐memory computing, effectively overcoming the limitations of the von Neumann bottleneck. However, progress in this field necessitates a comprehensive understanding of suitable structures and techniques for integrating low‐dimensional materials into optoelectronic integrated circuit platforms. This review aims to offer a comprehensive overview of the fundamental performance, mechanisms, design of structures, applications, and integration roadmap of optoelectronic synaptic memristors. By establishing connections between materials, multilayer optoelectronic memristor units, and monolithic optoelectronic integrated circuits, this review seeks to provide insights into emerging technologies and future prospects that are expected to drive innovation and widespread adoption in the near future.

Funder

National Basic Research Program of China

National Natural Science Foundation of China

National Research Foundation Singapore

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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