Electrically Programmable Interfacial Adhesion for Ultrastrong Hydrogel Bonding-Reference-Cited by-同舟云学术

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Electrically Programmable Interfacial Adhesion for Ultrastrong Hydrogel Bonding

Published:2022-02-21 Issue:13 Volume:34 Page:2108820
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Liu Yaqian¹²³,Wang Pudi²⁴,Su Xing²⁴,Xu Liang²,Tian Zhuoling²,Wang Hao²⁴,Ji Guojun¹,Huang Jianyong²⁴^ORCID

Affiliation:

1. College of Science Inner Mongolia University of Technology Hohhot 010051 China

2. College of Engineering Peking University Beijing 100871 China

3. Wenzhou Institute University of Chinese Academy of Sciences Oujiang Laboratory Wenzhou Zhejiang 325000 China

4. Beijing Innovation Center for Engineering Science and Advanced Technology Peking University Beijing 100871 China

Funder

Natural Science Foundation of Beijing Municipality

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202108820

Reference73 articles.

1. Design, fabrication and control of soft robots

2. Instant tough bonding of hydrogels for soft machines and electronics

3. Tissue-like skin-device interface for wearable bioelectronics by using ultrasoft, mass-permeable, and low-impedance hydrogels

4. A Robust Wearable Point‐of‐Care CNT‐Based Strain Sensor for Wirelessly Monitoring Throat‐Related Illnesses

5. Balancing the mechanical, electronic, and self-healing properties in conductive self-healing hydrogel for wearable sensor applications

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3. Deformation‐Resistant Underwater Adhesion in a Wide Salinity Range;Small;2024-07-10

4. Multiple non-covalent interactions for mechanically robust and electrically detachable liquid-free poly(ionic liquids) ionoadhesives;Chemical Engineering Journal;2024-07

5. A facile and on-demand optimizing strategy for polyurethane elastomers via programmable hydrogen bonding;Chemical Engineering Journal;2024-07

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