Instant tough bonding of hydrogels for soft machines and electronics

Author:

Wirthl Daniela1ORCID,Pichler Robert1ORCID,Drack Michael1,Kettlguber Gerald1ORCID,Moser Richard1,Gerstmayr Robert2,Hartmann Florian13,Bradt Elke2ORCID,Kaltseis Rainer1ORCID,Siket Christian M.1,Schausberger Stefan E.1,Hild Sabine2ORCID,Bauer Siegfried1,Kaltenbrunner Martin3ORCID

Affiliation:

1. Department of Soft Matter Physics, Johannes Kepler University Linz, Altenbergerstrasse 69, 4040 Linz, Austria.

2. Institute of Polymer Science, Johannes Kepler University Linz, 4040 Linz, Austria.

3. Linz Institute of Technology, Soft Electronics Laboratory, Johannes Kepler University Linz, 4040 Linz, Austria.

Abstract

A strategy for bonding water-rich hydrogels to diverse materials for electronic skins, energy storage, and soft optics is reported.

Funder

European Research Council

Horizon 2020 Framework Programme

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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