Looking Beyond 0 and 1: Principles and Technology of Multi‐Valued Logic Devices-Reference-Cited by-同舟云学术

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Looking Beyond 0 and 1: Principles and Technology of Multi‐Valued Logic Devices

Published:2022-11-17 Issue:51 Volume:34 Page:2108830
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Advanced Materials

Author:

Andreev Maksim¹,Seo Seunghwan¹^ORCID,Jung Kil‐Su²³,Park Jin‐Hong¹⁴^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering Sungkyunkwan University Suwon 16419 Korea

2. Department of Semiconductor and Display Engineering Sungkyunkwan University Suwon 440‐746 Korea

3. Memory Technology Design Team Samsung Electronics Co. Ltd Hwasung 18448 Korea

4. SKKU Advanced Institute of Nanotechnology (SAINT) Sungkyunkwan University Suwon 16419 Korea

Funder

National Research Foundation of Korea

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202108830

Reference135 articles.

1. Design of ion-implanted MOSFET's with very small physical dimensions

2. Interconnect scaling-the real limiter to high performance ULSI

3. Interconnect-power dissipation in a microprocessor

4. The Prospects for Multivalued Logic: A Technology and Applications View

5. Multiple-Valued Logic—its Status and its Future

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design implementations of ternary logic systems: A critical review;Results in Engineering;2024-09

2. Exploring new logic devices: Unlocking potential with floating-gate transistor;Applied Physics Reviews;2024-08-09

3. Optics‐Enabled Highly Scalable Inverter for Multi‐Valued Logic;Laser & Photonics Reviews;2024-08-03

4. Configurable anti-ambipolar photoresponses for optoelectronic multi-valued logic gates;Applied Physics Letters;2024-07-29

5. A Full-System Approach to Multi-Valued Logic Design: (PhD Forum Paper);2024 IEEE 35th International Conference on Application-specific Systems, Architectures and Processors (ASAP);2024-07-24

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