The effect of the ring opening polymerization and chain spacing on the coefficient of thermal expansion and modulus of polyimide
Author:
Affiliation:
1. Department of Chemical and Biomolecular Engineering; Yonsei University; 262 Seongsanno, Seodaemun-gu Seoul 120-749 South Korea
2. Department of R&D; LG Display; Gyeonggi 413-811 Korea, LG Display
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.42607/fullpdf
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1. Study of out-of-plane elastic properties of PMDA-ODA and BPDA-PDA polyimide thin films
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3. Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film
4. Mechanical characterization of polymer passivation layer in semiconductor applications using IIT and FEA
5. Large scale, flexible organic transistor arrays and circuits based on polyimide materials
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