Mechanical characterization of polymer passivation layer in semiconductor applications using IIT and FEA-Reference-Cited by-同舟云学术

Mechanical characterization of polymer passivation layer in semiconductor applications using IIT and FEA

Published:2010-11 Issue:11 Volume:87 Page:2288-2293
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Lee Gyujei,Kim Yuhwan,Kwon Dongil

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. J.D. Rose, in: OCG Microlithography Seminar, Interface, 1994, p. 269.

2. P. Cheang, L. Christensen, C. Reynaga, in: Surface Mount Technology Seminar, 1996, p. 1.

3. C. Schuckert et al., in: IEEE/SEMI Advanced Semiconductor Manufacturing Conference Proceedings, 1990, p. 72.

4. H. Matsumoto et al., in: IEEE/IRPS Proceedings, 1985.

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