MultiFeNet: Multi‐scale feature scaling in deep neural network for the brain tumour classification in MRI images

Author:

Agrawal Tarun1ORCID,Choudhary Prakash2,Shankar Achyut34ORCID,Singh Prabhishek5,Diwakar Manoj67ORCID

Affiliation:

1. Department of CSE & IT Jaypee Institute of Information Technology Noida India

2. Department of CSE Central University of Rajasthan Ajmer India

3. WMG University of Warwick Coventry UK

4. School of Computer Science Engineering Lovely Professional University Phagwara India

5. School of Computer Science Engineering and Technology Bennett University Greater Noida India

6. Department of CSE Graphic Era Deemed to be University Dehradun India

7. Department of CSE Graphic Era Hill University Dehradun India

Abstract

AbstractOne of the most fatal and prevalent diseases of the central nervous system is a brain tumour. Different subgrades exist for each type of brain tumour because of the broad variety of brain tumours and tumour pathologies. Manual diagnosis may be error‐prone and time‐consuming, both of which are becoming more challenging as the medical community's workload grows. There is a need for automatic diagnosis. In this study, we have proposed a deep learning model (MultiFeNet) based on a convolutional neural network for the classification of brain tumours. MultiFeNet uses multi‐scale feature scaling for feature extraction in magnetic resonance imaging (MRI) images. Multi‐scaling helps to learn the better feature representation of the MRI image for enhanced model performance. To evaluate the proposed model, 3064 MRI scans of three distinct categories of brain tumours (meningiomas, gliomas and pituitary tumours) were used. The MultiFeNet obtained 96.4% sensitivity, 96.4% F1‐score, 96.4% precision and 96.4% accuracy on the benchmark Figshare dataset. In addition, an ablation study is conducted with the objective of evaluating the role of multi‐scaling in model performance.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Vision and Pattern Recognition,Software,Electronic, Optical and Magnetic Materials

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