Mechanical behavior monitoring of composite hybrid bonded‐riveted joints using high‐stability MXene sensors

Author:

Zhang Lu1,Xie Yunqi2,Lu Shaowei1ORCID,Zhang Binbin2,Wang Xing2,Li Xingliang3,Li Wei1ORCID,Wang Xiaoqiang2

Affiliation:

1. College of Material Science and Engineering Shenyang Aerospace University Shenyang China

2. College of Aerospace Engineering Shenyang Aerospace University Shenyang China

3. Aviation Key Laboratory of Science and Technology on Precision Manufacturing Beijing Institute of Aeronautical Precision Machinery Beijing China

Abstract

AbstractComposite adhesive rivet hybrid connection structure has been more and more recognized and applied in aerospace, automobile, and other industries due to its high strength, corrosion resistance, and good stability. However, due to the particularity of the composite structure and the complex nonlinear coupling factors existing in the bearing process of the adhesive rivet hybrid connection structure, it is difficult to carry out structural health monitoring of the composite adhesive rivet hybrid connection structure. In this paper, a new fabrication technique is proposed to fabricate MXene thin film sensors with excellent performance. The MXene sensor can be tailored to the required size and arrangement to monitor the hybrid connection structure. The multi‐stage loading‐unloading test verifies the feasibility of using the MXene sensor to monitor the hybrid connection structure. The monitoring curves of the MXene sensor for composite adhesive rivet mixed connection structure specimens under low‐speed impact test and vibration fatigue test were obtained, and the sensing mechanism of the MXene sensor was explained. The proposed monitoring method based on the MXene sensor is suitable for the health monitoring of adhesive rivet hybrid connection structures under tensile‐compression, impact, and vibration conditions.Highlights MXene sensors can be integrated into composite hybrid bonded‐riveted joints without defects. MXene sensors combined with flexible circuits can form a high‐stability monitoring array. Monitor the mechanical behavior of bonded and riveted areas by the resistance change rate of MXene sensors. Real‐time monitor the micro damage and acceleration changes under the vibration environments.

Funder

Chinese Aeronautical Establishment

Chunhui Project Foundation of the Education Department of China

Natural Science Foundation of Shenyang Municipality

Publisher

Wiley

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