Boosting the Heat Dissipation Performance of Graphene/Polyimide Flexible Carbon Film via Enhanced Through‐Plane Conductivity of 3D Hybridized Structure-Reference-Cited by-同舟云学术

Boosting the Heat Dissipation Performance of Graphene/Polyimide Flexible Carbon Film via Enhanced Through‐Plane Conductivity of 3D Hybridized Structure

Published:2020-01-30 Issue:8 Volume:16 Page:1903315
ISSN:1613-6810
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Author:

Li Yanhua¹²,Zhu Yanfei¹³,Jiang Gaopeng³,Cano Zachary P.³,Yang Jun⁴,Wang Jin⁴,Liu Jilei¹,Chen Xiaohua¹,Chen Zhongwei³^ORCID

Affiliation:

1. College of Materials Science and EngineeringHunan University Changsha 410082 P. R. China

2. College of Materials and Chemistry EngineeringHunan Institute of Technology Hengyang 421002 P. R. China

3. Department of Chemical EngineeringWaterloo Institute for NanotechnologyWaterloo Institute for Sustainable EnergyUniversity of Waterloo Waterloo Ontario N2L 3G1 Canada

4. Zhuzhou Times New Material Technology Co., LTD Zhuzhou 412007 P. R. China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province

Natural Sciences and Engineering Research Council of Canada

China Scholarship Council

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.201903315