High thermal conductive epoxy molding compound with thermal conductive pathway-Reference-Cited by-同舟云学术

High thermal conductive epoxy molding compound with thermal conductive pathway

Published:2009-08-15 Issue:4 Volume:113 Page:2117-2125
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Zeng Jun,Fu Renli,Shen Yuan,He Hong,Song Xiufeng

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.30045/fullpdf

Reference26 articles.

1. Siu, B. In Proceedings of the 1995 IEEE TENCON-Asia-Pacific Microelectronics 2000; IEEE: Hongkong, 1995; p 234.

2. Kumbhat, N.; Raj, P. M.; Pucha, R. V.; Atmur, S.; Doraiswamy, R.; Sundaram, V.; Bhattacharya, S.; Sitaraman, S. K.; Tummala, R. R. In Proceedings of the 55th IEEE Electronic Components & Technology Conference; IEEE: Lake Buena Vista, FL, 2005; p 1363.

3. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation

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