Integration of Electrochemical Microsupercapacitors with Thin Film Electronics for On‐Chip Energy Storage-Reference-Cited by-同舟云学术

Integration of Electrochemical Microsupercapacitors with Thin Film Electronics for On‐Chip Energy Storage

Published:2019-05-06 Issue:25 Volume:31 Page:1807450
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Hota Mrinal K.¹,Jiang Qiu¹,Wang Zhenwei¹,Wang Zhong Lin²,Salama Khaled N.³,Alshareef Husam N.¹^ORCID

Affiliation:

1. Materials Science and EngineeringPhysical Science and Engineering DivisionKing Abdullah University of Science and Technology (KAUST) Thuwal 23955–6900 Saudi Arabia

2. School of Materials Science and EngineeringGeorgia Institute of Technology Atlanta GA 30332‐0245 USA

3. Sensors labAdvanced Membranes, and Porous Materials CenterComputer, Electrical, and Mathematical Science and Engineering DivisionKing Abdullah University of Science and Technology (KAUST) Thuwal 23955–6900 Saudi Arabia

Funder

King Abdullah University of Science and Technology

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201807450

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