Biodegradable Materials for Multilayer Transient Printed Circuit Boards-Reference-Cited by-同舟云学术

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Biodegradable Materials for Multilayer Transient Printed Circuit Boards

Published:2014-09-22 Issue:43 Volume:26 Page:7371-7377
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Huang Xian¹²,Liu Yuhao¹,Hwang Suk-Won¹,Kang Seung-Kyun¹,Patnaik Dwipayan¹,Cortes Jonathan Fajardo¹,Rogers John A.¹

Affiliation:

1. University of Illinois at Urbana-Champaign; Frederick Seitz Materials Research Laboratory; 104 S. Goodwin Ave Urbana IL 61801 USA

2. Missouri University of Science and Technology; Mechanical and Aerospace Engineering; 400 West 13th Street Rolla MO 65409 USA

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adma.201403164/fullpdf

Reference52 articles.

1. Fiberglass and Glass Technology

2. E-waste: An assessment of global production and environmental impacts

3. Environmental contamination from electronic waste recycling at Guiyu, southeast China

4. Global perspectives on e-waste

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