High-Operating-Temperature Direct Ink Writing of Mesoscale Eutectic Architectures-Reference-Cited by-同舟云学术

High-Operating-Temperature Direct Ink Writing of Mesoscale Eutectic Architectures

Published:2016-12-15 Issue:7 Volume:29 Page:1604778
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Boley J. William¹,Chaudhary Kundan¹,Ober Thomas J.¹,Khorasaninejad Mohammadreza¹,Chen Wei Ting¹,Hanson Erik²,Kulkarni Ashish³,Oh Jaewon⁴,Kim Jinwoo³,Aagesen Larry K.²,Zhu Alexander Y.¹,Capasso Federico¹,Thornton Katsuyo²,Braun Paul V.³,Lewis Jennifer A.¹

Affiliation:

1. John A. Paulson School of Engineering and Applied Sciences; Wyss Institute for Biologically Inspired Engineering; Harvard University; Cambridge MA 02138 USA

2. Department of Materials Science and Engineering; University of Michigan; Ann Arbor MI 48109 USA

3. Department of Materials Science and Engineering; Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

4. University of Waterloo; Waterloo ON N2L 3G1 Canada

Funder

Air Force Office of Scientific Research Multidisciplinary University Research Initiative

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference33 articles.

1. The Promise of Plasmonics

2. Nanoscale Science and Technology: Building a Big Future from Small Things

3. Metamaterial Electromagnetic Cloak at Microwave Frequencies

4. An optical cloak made of dielectrics

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