Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4?-diaminodiphenylmethane
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference16 articles.
1. Competition between cure and thermal degradation in a high Tg epoxy system: Effect of time and temperature of isothermal cure on the glass transition temperature
2. Thermoanalysis Introduction: Chemical Industry Publishing Co.: Beijing, 1991.
3. U.S. Pat. 2,767,157 (1956).
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