Author:
Bang Yong-Seung,Kim Jung-Mu,Kim Jong-Man,Kim Yong-Kweon,Jang Yun-Ho
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. H. Reichl V. Grosser Overview and development of trends in the field of MEMS packaging, In: Proceedings of the IEEE MEMS 2001 Conference, Interlaken, Switzerland 2001 1 5
2. C. O'Neal A.P. Malshe S.B. Singh W.D. Brown W.P. Eaton Challenges in the packaging of MEMS, 1999 International Symposium on Advanced Packaging Materials, Braselton, Georgia 1999 41 47
3. Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer;Kim;J Micromech Microeng,2006
4. MEMS for wireless communications: ‘From RF-MEMS components to RF-MEMS SiP,’;Tilmans;J Micromech Microeng,2003
5. M. Reimann M. Ulm T. Buck R. Muller-Fiedler W. Heinrich Vertical silicon K-band CPW through-wafer interconnects, European Microwave Conference, Milan, Italy 2002 1 4
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献