Boosting flexible electronics with integration of two‐dimensional materials

Author:

Hou Chongyang1ORCID,Zhang Shuye2,Liu Rui13ORCID,Gemming Thomas4,Bachmatiuk Alicja5,Zhao Hongbin6,Jia Hao3,Huang Shirong7,Zhou Weijia1ORCID,Xu Jian‐Bin8ORCID,Pang Jinbo13ORCID,Rümmeli Mark H.49101112,Bi Jinshun131415,Liu Hong116ORCID,Cuniberti Gianaurelio7

Affiliation:

1. Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China

2. State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin the People’s Republic of China

3. State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai the People’s Republic of China

4. Institute for Materials Chemistry Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden) Dresden Germany

5. Lukasiewicz Research Network PORT Polish Center for Technology Development Wroclaw Poland

6. State Key Laboratory of Advanced Materials for Smart Sensing GRINM Group Co. Ltd Beijing the People’s Republic of China

7. Institute for Materials Science and Max Bergmann Center of Biomaterials TUD Dresden University of Technology Dresden Germany

8. Department of Electronic Engineering The Chinese University of Hong Kong Hong Kong SAR the People’s Republic of China

9. Institute of Environmental Technology VŠB‐Technical University of Ostrava Ostrava Czech Republic

10. College of Energy, Soochow Institute for Energy and Materials Innovations Soochow University Suzhou the People’s Republic of China

11. Key Laboratory of Advanced Carbon Materials and Wearable Energy Technologies of Jiangsu Province Soochow University Suzhou the People’s Republic of China

12. Centre of Polymer and Carbon Materials Polish Academy of Sciences Zabrze Poland

13. School of Integrated Circuits University of Chinese Academy of Sciences Beijing the People’s Republic of China

14. Institute of Microelectronics of Tianjin Binhai New Area Tianjin the People’s Republic of China

15. Institute of Microelectronics Chinese Academy of Sciences Beijing the People’s Republic of China

16. State Key Laboratory of Crystal Materials, Center of Bio and Micro/Nano Functional Materials Shandong University Jinan the People’s Republic of China

Abstract

AbstractFlexible electronics has emerged as a continuously growing field of study. Two‐dimensional (2D) materials often act as conductors and electrodes in electronic devices, holding significant promise in the design of high‐performance, flexible electronics. Numerous studies have focused on harnessing the potential of these materials for the development of such devices. However, to date, the incorporation of 2D materials in flexible electronics has rarely been summarized or reviewed. Consequently, there is an urgent need to develop comprehensive reviews for rapid updates on this evolving landscape. This review covers progress in complex material architectures based on 2D materials, including interfaces, heterostructures, and 2D/polymer composites. Additionally, it explores flexible and wearable energy storage and conversion, display and touch technologies, and biomedical applications, together with integrated design solutions. Although the pursuit of high‐performance and high‐sensitivity instruments remains a primary objective, the integrated design of flexible electronics with 2D materials also warrants consideration. By combining multiple functionalities into a singular device, augmented by machine learning and algorithms, we can potentially surpass the performance of existing wearable technologies. Finally, we briefly discuss the future trajectory of this burgeoning field. This review discusses the recent advancements in flexible sensors made from 2D materials and their applications in integrated architecture and device design.

Funder

National Key Research and Development Program of China Stem Cell and Translational Research

National Natural Science Foundation of China

State Key Laboratory of Biobased Material and Green Papermaking, Qilu University of Technology

European Regional Development Fund

Publisher

Wiley

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