High temperature dielectric study of epoxy resins-Reference-Cited by-同舟云学术

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High temperature dielectric study of epoxy resins

Published:1980-05 Issue:8 Volume:20 Page:546-550
ISSN:0032-3888
Container-title:Polymer Engineering and Science
language:en
Short-container-title:Polym. Eng. Sci.

Author:

Lawless G. W.

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Reference15 articles.

1. Mater. Eval, 49 (March, 1976).

2. Mater. Eval, 48 (June, 1977).

3. SAMPE J., 11 (July/August, 1978).

4. Proc. of the First International Conf. on Polym. Proc., 1977, M.I.T. Press (1978).

5. 22nd Nat'l SAMPE Symposium and Exhibit, Vol. 22, p. 410, (26-28 April, 1977).

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1. Dielectric Measurements for Monitoring the Cure of Epoxies and Composite Materials;Comprehensive Composite Materials;2000

2. Variation in dielectric properties of an epoxy-novolac molding compound during dynamic cure;Polymer Engineering & Science;1999-07

3. Rheological and dielectric changes during isothermal epoxy-amine cure;Journal of Polymer Science Part B: Polymer Physics;1995-01-15

4. The effect of stoichiometry on chain segment and ion mobility in partially polymerized epoxy systems;Journal of Polymer Science Part B: Polymer Physics;1995-01-15

5. The viscosity and ion conductivity of polydimethylsiloxane systems: 2. Ion concentration effects;Polymer;1994-10

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