Author:
Shaffer E. O.,McGarry F. J.,Hoang Lan
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference12 articles.
1. and in ASM Materials Developments in Microelectronic Packaging Conference Proceedings, ed., ASM International, Materials Park, Ohio (1991).
2. and Microelectronics Packaging Handbook Van Nostrand Reinhold, New York (1989).
3. The cracking and decohesion of thin films
4. Delamination from surface cracks in composite materials
5. A Self-Delamination Method of Measuring the Surface Energy of Adhesion of Coatings
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献