The cracking and decohesion of thin films-Reference-Cited by-同舟云学术

The cracking and decohesion of thin films

Published:1988-10 Issue:5 Volume:3 Page:1043-1049
ISSN:0884-2914
Container-title:Journal of Materials Research
language:en
Short-container-title:J. Mater. Res.

Author:

Evans A. G.,Drory M. D.,Hu M. S.

Abstract

The cracking and decohesion of thin films can be characterized by critical values of a nondimensional parameter governed by the residual stress, the film thickness, and a fracture resistance. This article reviews the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness, and yield strength are described.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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