Low‐Temperature Polysilicon Oxide Thin‐Film Transistors with Coplanar Structure Using Six Photomask Steps Demonstrating High Inverter Gain of 264 V V −1-Reference-Cited by-同舟云学术

Low‐Temperature Polysilicon Oxide Thin‐Film Transistors with Coplanar Structure Using Six Photomask Steps Demonstrating High Inverter Gain of 264 V V −1

Published:2020-02-13 Issue:4 Volume:22 Page:1901497
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Jeong Duk Young¹,Chang Yeoungjin¹²,Yoon Won Gyeong¹,Do Youngbin¹,Jang Jin¹^ORCID

Affiliation:

1. Advanced Display Research Center Department of Information Display Kyung Hee University Seoul 130‐701 South Korea

2. Department of Computer Engineering Gachon University Gyeonggi 13120 Korea

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.201901497

Reference46 articles.

1. Polysilicon TFT technology for active matrix OLED displays

2. A Novel Five-Photomask Low-Temperature Polycrystalline Silicon CMOS Structure for AMLCD Application

3. 16.2: World-Best Performance LTPS TFTs with Robust Bending Properties on AMOLED Displays

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Large‐Area Growth of Ferroelectric 2D γ‐In₂Se₃ Semiconductor by Spray Pyrolysis for Next‐Generation Memory;Advanced Materials;2023-12-03

2. Thin‐Film Transistors for Integrated Circuits: Fundamentals and Recent Progress;Advanced Functional Materials;2023-10-11

3. Micro Light-Emitting Diode Pixel Circuit Based on p-Type Low-Temperature Polycrystalline Silicon Thin-Film Transistor for Mobile Displays;IEEE Transactions on Electron Devices;2023-09

4. Recent advances in flexible noninvasive electrodes for surface electromyography acquisition;npj Flexible Electronics;2023-08-16

5. 47‐4: Highly Sensitive Lateral Poly‐Si PIN Photodiode by Blue Laser Annealing of 400 nm Amorphous Si for Near Infrared Light Sensing;SID Symposium Digest of Technical Papers;2023-06