The role of a ternary Ni-Sn-P layer as a diffusion barrier in the Sn-Ag solder/electroless Ni-P system-Reference-Cited by-同舟云学术

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The role of a ternary Ni-Sn-P layer as a diffusion barrier in the Sn-Ag solder/electroless Ni-P system

Published:2012-04-12 Issue:11-12 Volume:44 Page:1503-1506
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Bae Jee-Hwan¹,Kang Han-Byul¹²,Ryu Jiho³,Yang Cheol-Woong¹

Affiliation:

1. School of Advanced Materials Science and Engineering; Sungkyunkwan University; 300 Cheoncheon-dong, Jangan-gu Suwon Gyeonggi-do 440-746 Korea

2. LG Innotek Co.; Wollong Industry Complex, 1493, Naepo-ri, Munsan-eup Paju-city Gyeonggi-do 413-901 Korea

3. Department of Automobile Development; Ajou Motor College; Boryeong 355-769 Korea

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/sia.4986/fullpdf

Reference13 articles.

1. Advances in lead-free electronics soldering

2. Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder

3. Lead-free Solders in Microelectronics

4. Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders

5. Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research progress in diffusion barrier for advanced electronic packaging;CAILIAO GONGCHENG;2023

2. Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review;Microelectronic Engineering;2019-02

3. Phase Transformation of the Ni3P Phase at the Interface Between Sn and the Ni3P/Ni Substrate;Science of Advanced Materials;2016-11-01

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