Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction-Reference-Cited by-同舟云学术

Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction

Published:2022-10-17 Issue:1 Volume:34 Page:419-429
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polymers for Advanced Techs

Author:

Dai Tianwen¹,Jiang Xinyue¹,Ge Ying¹,Zou Huawei¹,Liu Pengbo¹^ORCID

Affiliation:

1. State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China

Publisher

Wiley

Subject

Polymers and Plastics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.5901

Reference30 articles.

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3. Preparation and properties of hollow silica tubes/cyanate ester hybrids for high-frequency copper-clad laminates

4. High-k and ultra-low-loss BADCy/Ni0.5Ti0.5NbO4 composites for PCB application fabricated by cold isostatic pressing and vacuum assisted infiltration processes

5. Advances in materials and processes for high‐performance electronics fabrication and assembly‐part II;Seibold RW;SAMPE Journal,1997

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