Author:
Mathuw R.,Advani S. G.,Heider D.,Hoffmann C.,Gillespie J. W.,Fink B. K.
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites
Reference20 articles.
1. United States Patent 4,902,215 (1990).
2. A Closed Form Solution for Flow During the Vacuum Assisted Resin Transfer Molding Process
3. and Low-Cost Distributed Sensors for flow and Cure Monitoring in Resin Injection Molding Processes, disclosure completed April 1997.
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