Mechanical and morphological properties of epoxy resins modified by poly(phthalazinone ether sulfone ketone)
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference30 articles.
1. Chemical toughening of epoxies. II. Mechanical, thermal, and microscopic studies of epoxies toughened with hydroxyl-terminated poly(butadiene-co-acrylonitrile)
2. Modification of epoxy resin using reactive liquid (ATBN) rubber
3. Analysis of the damage zone around the crack tip for two rubber-modified epoxy matrices exhibiting different toughenability
4. Morphology and fracture properties relationship of epoxy-diamine systems simultaneously modified with polysulfone and poly(ether imide)
5. Reaction mechanisms, microstructure, and fracture properties of thermoplastic polysulfone-modified epoxy resin
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite;Journal of Inorganic and Organometallic Polymers and Materials;2019-08-21
2. PPESK-Modified Multi-Functional Epoxy Resin and Its Application to the Pultrusion of Carbon Fiber;Polymers;2018-09-26
3. Preparation of Novel Epoxy Resins Bearing Phthalazinone Moiety and Their Application as High-Temperature Adhesives;Polymers;2018-06-26
4. Interlaminar Toughening of GFRP—Part II: Characterization and Numerical Simulation of Curing Kinetics;Journal of Manufacturing Science and Engineering;2017-03-24
5. Interlaminar Toughening of GFRP—Part I: Bonding Improvement Through Diffusion and Precipitation;Journal of Manufacturing Science and Engineering;2017-03-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3