Selective Electroplating for 3D‐Printed Electronics
Author:
Affiliation:
1. US Army Research Laboratory 2800 Powder Mill Road Adelphi MD 20783 USA
2. Department of ChemistryDuke University 124 Science Drive, Box 90354 Durham NC 27708 USA
Publisher
Wiley
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201900126
Reference30 articles.
1. Additive manufacturing and its societal impact: a literature review
2. 3D Printing for the Rapid Prototyping of Structural Electronics
3. Additive manufacturing (3D printing): A review of materials, methods, applications and challenges
4. Application of 3D Printing for Smart Objects with Embedded Electronic Sensors and Systems
5. Fabrication of Thermally Stable Silver-Organic Complex (TS-SOC) Based Conductible Filament Materials for 3D Printing
Cited by 40 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electroplating in the modern era, improvements and challenges: A review;Hybrid Advances;2024-12
2. Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits;Extended Abstracts of the CHI Conference on Human Factors in Computing Systems;2024-05-02
3. A comprehensive review on surface modifications of polymer‐based 3D‐printed structures: Metal coating prospects and challenges;Polymers for Advanced Technologies;2024-04
4. 3D Printed Alumina for Geometrically-Complex Electronic Substrates With High-Performance Printed Conductors;IEEE Access;2024
5. Advances in Additive Manufacturing Techniques for Electrochemical Energy Storage;Advanced Materials Technologies;2023-12-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3