Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits-Reference-Cited by-同舟云学术

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Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Published:2024-05-02 Issue: Volume: Page:1-6
ISSN:
Container-title:Extended Abstracts of the CHI Conference on Human Factors in Computing Systems
language:
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Author:

Li Xiaolong¹^ORCID,Yao Cheng¹^ORCID,Zhou Yujie¹^ORCID,Feng Shuyue¹^ORCID,Li Zhengke¹^ORCID,Cheng Yiming¹^ORCID,Huang Shichao¹^ORCID,Dong Haoye¹^ORCID,Xue Mengru²^ORCID,Wang Guanyun¹^ORCID

Affiliation:

1. Zhejiang University, China and Zhejiang University, China

2. Ningbo Innovation Center, Zhejiang University, China and Ningbo Innovation Center, Zhejiang University, China

Funder

Fundamental Research Funds for the Central Universi-ties, the Engineering Research Center of Computer-Aided Product Innovation Design Min-istry of Education, National Natural Science Foundation of China (Grant No. 52075478), and National Social Science Foundation of China (Grant No. 21AZD056).

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3613905.3651098

Reference18 articles.

1. Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces

2. [2] Bambulab. January 26 2024. https://bambulab.cn/zh-cn

3. 3D Folded PrintGami

4. Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending

5. Assembly and applications of 3D conformal electronics on curvilinear surfaces

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