Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending-Reference-Cited by-同舟云学术

Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending

Published:2021-05-06 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems
language:
Short-container-title:

Author:

Hong Freddie¹,Myant Connor²,Boyle David E³

Affiliation:

1. Dysong School of Design Engineering Imperial College London, United Kingdom

2. Imperial College London, United Kingdom

3. Systems and Algorithms Laboratory Imperial College London, United Kingdom

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3411764.3445469

Reference43 articles.

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2. [n.d.]. Multi3D. https://www.multi3dllc.com/faqs/ [n.d.]. Multi3D. https://www.multi3dllc.com/faqs/

3. [n.d.]. Optomec Aerosol Jet printing technology effectively produces 3D printed electronics. https://optomec.com/printed-electronics/aerosol-jet- technology/ [n.d.]. Optomec Aerosol Jet printing technology effectively produces 3D printed electronics. https://optomec.com/printed-electronics/aerosol-jet- technology/

4. [n.d.]. PRUSA I3 MK3S 3D PRINTER. https://www.prusa3d.com/original-prusa-i3-mk3/ [n.d.]. PRUSA I3 MK3S 3D PRINTER. https://www.prusa3d.com/original-prusa-i3-mk3/

5. [n.d.]. Voxel8 Print specifications. http://store.voxel8.com/faq [n.d.]. Voxel8 Print specifications. http://store.voxel8.com/faq

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