Modular Lego-Electronics

Author:

Shaikh Sohail F.1,Ghoneim Mohamed T.1,Bahabry Rabab R.12,Khan Sherjeel M.1,Hussain Muhammad M.1ORCID

Affiliation:

1. Integrated Disruptive Electronic Applications (IDEA) Lab and Integrated Nanotechnology Lab; Computer Electrical Mathematical Science and Engineering Division; King Abdullah University of Science and Technology (KAUST); Thuwal 23955-6900 Saudi Arabia

2. Integrated Nanotechnology Lab and Integrated Disruptive Electronic Applications (IDEA) Lab; Material Science and Engineering; Physical Science and Engineering Division; King Abdullah University of Science and Technology; Thuwal 23955-6900 Saudi Arabia

Funder

King Abdullah University of Science and Technology

Office of Sponsored Research

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Dual-Functional Self-Attachable and Stretchable Interface for Universal Three-Dimensional Modular Electronics;ACS Applied Materials & Interfaces;2022-10-14

2. 3D Heterogeneous Integration Strategy for Physically Flexible CMOS Electronic Systems;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

3. The 2021 flexible and printed electronics roadmap;Flexible and Printed Electronics;2021-05-17

4. 3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems;2020 IEEE International Interconnect Technology Conference (IITC);2020-10-05

5. Flexible and Stretchable Electronics for Harsh‐Environmental Applications;Advanced Materials Technologies;2019-08-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3