Characterization of differential via holes using equivalent circuit extraction technique-Reference-Cited by-同舟云学术

Characterization of differential via holes using equivalent circuit extraction technique

Published:2007-09-13 Issue:6 Volume:17 Page:552-559
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int J RF and Microwave Comp Aid Eng

Author:

Nguyen Tao V.,Morales Aldo,Agili Sedig

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/mmce.20256/fullpdf

Reference10 articles.

1. Modeling differential via holes;Laermans;IEEE Trans Adv Packag,2001

2. Modeling complex via hole structures;Laermans;IEEE Trans Adv Packag,2002

3. Fast capacitance extraction of general three-dimensional structures;Nabors;IEEE Trans Microwave Theory Tech,1992

4. Analysis of a large number of vias and differential signaling in multilayer structures;Chen;IEEE Trans Microwave Theory Tech,2003

5. S. Luan J. Selli J.L. Drewniak A. De Luca G. Antonini A. Soegna A. Orlandi J. Fan J.L. Knighten N. Smith R Alexander Extraction of a SPICE via model from full-wave modeling for differential signaling 2004 577 582

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