Taguchi-numerical approach on thermomechanical reliability for PBGA-Reference-Cited by-同舟云学术

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Taguchi-numerical approach on thermomechanical reliability for PBGA

Published:2010-11-11 Issue:5 Volume:24 Page:437-447
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int. J. Numer. Model.

Author:

Yang Ping,Tan Guangbin

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/jnm.789/fullpdf

Reference16 articles.

1. Plastic ball grid array solder joint reliability for avionics applications;Qi;IEEE Transactions on Components and Packaging Technologies,2007

2. COTS BGA thermal fatigue test for avionics applications;Fenger;Advances in Electronic Packaging,2003

3. Yu Q Shibutani T Kobayashi Y The effect of voids on thermal reliability of BGA lead free solder joint and reliability detecting standard 1024 1030

4. Fatigue life of leadless chip carrier solder joint during power cycling;Engelmaier;IEEE CHMT,1983

5. Wear-out system reliability with multiple components and load levels;Engelmaier;Global SMT and Packaging,2008

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1. Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load;Microelectronics International;2020-09-04

2. Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly;Microelectronics Reliability;2016-04

3. Optimal design of fatigue life for RCP with PoP package by using the Taguchi method;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2014-12-05

4. Application of statistical method to investigate the effects of design parameters on the performance of microring resonator channel dropping filter;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2013-04-03

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