Optimal design of fatigue life for RCP with PoP package by using the Taguchi method-Reference-Cited by-同舟云学术

Optimal design of fatigue life for RCP with PoP package by using the Taguchi method

Published:2014-12-05 Issue:3-4 Volume:30 Page:e2036
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int. J. Numer. Model.

Author:

Cheng Hsin-En¹²,Chen Rong-Sheng¹

Affiliation:

1. Department of Engineering Science; National Cheng Kung University; Tainan 701 Taiwan, ROC

2. Technical Development Department; NXP Semiconductors Taiwan; 811 Kaohsiung City Taiwan, ROC

Funder

National Science Council of Taiwan, R.O.C.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Reference23 articles.

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3. Yoshida A. Taniguchi J Murata K Kada M Yamamoto Y Takagi Y Notomi T Fjita A. A study on package stacking process for package-on-package (PoP) roceedings of the 56th International Conference of the IEEE Electronic Components and Technology Conference 2006 825 830 10.1109/ECTC.2006.1645753

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5. Ramanathan LN Keser B Amrine C Duong T Hayes S Leal G Mangrum M Mitchell D Wenzel R Implementation of a Mobile Phone Module with Redistributed Chip Packaging Proceedings of the 58th International Conference of the IEEE Electronic Components and Technology Conference 2008 1117 1120 10.1109/ECTC.2008.4550115