Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer-Reference-Cited by-同舟云学术

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Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer

Published:2020-09-20 Issue:4 Volume:22 Page:705-714
ISSN:1507-2711
Container-title:Eksploatacja i Niezawodnosc - Maintenance and Reliability
language:
Short-container-title:EiN

Author:

Chen Yuan,Su Wei,Huang Hong-Zhong,Lai Ping,Lin Xiao-Ling,Chen Si

Publisher

Polskie Naukowo-Techniczne Towarzystwo Eksploatacyjne

Subject

Industrial and Manufacturing Engineering,Safety, Risk, Reliability and Quality

Link

http://www.ein.org.pl/sites/default/files/2020-04-14.pdf

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06

2. Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Holding time effect on mechanical properties and protrusion behaviors of through silicon via copper under various annealing processes;Materials Science in Semiconductor Processing;2023-05

4. Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study;IEEE Transactions on Device and Materials Reliability;2023-03

5. Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current;Silicon;2023-02-27

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