Retardation Phenomenon Applied to the Thermal Conduction in Foodstuffs during a Variety of Heating Procedures-Reference-Cited by-同舟云学术

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Retardation Phenomenon Applied to the Thermal Conduction in Foodstuffs during a Variety of Heating Procedures

Published:2005 Issue:2 Volume:33 Page:93-100
ISSN:0387-1533
Container-title:Nihon Reoroji Gakkaishi
language:en
Short-container-title:J. Soc. Rheol., Jpn

Author:

Nagao Keiko¹,Matsumoto Sachio²

Affiliation:

1. Faculty of Home Economics, Tokyo Kasei University

2. Former College of Agriculture, Osaka Prefecture University

Publisher

Society of Rheology Japan

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://www.jstage.jst.go.jp/article/rheology/33/2/33_2_93/_pdf

Reference12 articles.

1. OCCURRENCE OF RUPTURES ON THE SURFACE OF FOODS DURING FRYING

2. 5) Kundsen JG, Katz DL, "Fluid Dynamics and Heat Transfer ", (1958), McGraw-Hill Inc, NY.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Conduction in Egg Albumen Foam (Meringue) during Heating;Nippon Shokuhin Kagaku Kogaku Kaishi;2010

2. Effect of Baking Powder in Wheat Flour Dough on Its Thermal Conduction during Heating;Food Science and Technology Research;2009

3. Attempt at Measuring Thermal Conduction in O/W and W/O Emulsions Prepared by Using Edible-type Emulsifiers during Heating;Nippon Shokuhin Kagaku Kogaku Kaishi;2008

4. Studies on the thermal conduction in foodstuffs using a variety of model systems;Journal for the Integrated Study of Dietary Habits;2006

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