Preparation and Properties of Clay-Reinforced Epoxy Nanocomposites

Author:

Kusmono 1,Wildan M. W.1,Mohd Ishak Z. A.2

Affiliation:

1. Department of Mechanical and Industrial Engineering, Faculty of Engineering, Gadjah Mada University, Jln. Grafika No. 2 Yogyakarta 55281, Indonesia

2. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang, Malaysia

Abstract

The clay-reinforced epoxy nanocomposite was prepared by the polymerization method. The effect of clay addition on the mechanical properties of epoxy/clay nanocomposites was studied through tensile, flexural, impact strength, and fracture toughness tests. The morphology and tribology behavior of epoxy/clay nanocomposites were determined by X-ray diffraction (XRD) and wear test, respectively. The wear test was performed to determine the specific abrasion of the nanocomposites. In addition, the water absorption characteristic of the nanocomposites was also investigated in this study. XRD analysis indicated that the exfoliation structure was observed in the epoxy nanocomposites with 3 wt% of clay, while the intercalated structure was shown at 6 wt% of clay. It was found that the addition of clay up to 3 wt% increased the tensile strength, flexural strength, impact strength, and the fracture toughness. On the contrary, the presence of above 3 wt% of clay produced a reverse effect. It could be concluded that the best properties in mechanical, wear resistance, and water resistance were obtained for the epoxy nanocomposites containing 3 wt% of clay.

Funder

Universitas Gadjah Mada

Publisher

Hindawi Limited

Subject

Polymers and Plastics

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3