PEDOT:PSS-Containing Nanohydroxyapatite/Chitosan Conductive Bionanocomposite Scaffold: Fabrication and Evaluation

Author:

Lari Alireza1,Sun Tao2,Sultana Naznin13ORCID

Affiliation:

1. Faculty of Bioscience and Medical Engineering, Universiti Teknologi Malaysia, 81300 Skudai, Johor, Malaysia

2. Miniaturized Medical Devices Program, Institute of Microelectronics, Agency for Science, Technology and Research (A∗ STAR), Singapore 117685

3. Advanced Membrane Technology Research Center (AMTEC), Universiti Teknologi Malaysia, 81300 Skudai, Johor, Malaysia

Abstract

Conductive poly(3,4-ethylenedioxythiophene)-poly(4-styrene sulfonate) (PEDOT:PSS) was incorporated into nanohydroxyapatite/chitosan (nHA/CS) composite scaffolds through a freezing and lyophilization technique. The bionanocomposite conductive scaffold was then characterized using several techniques. A scanning electron microscope image showed that the nHA and PEDOT:PSS were dispersed homogeneously in the chitosan matrix, which was also confirmed by energy-dispersive X-ray (EDX) analysis. The conductive properties were measured using a digital multimeter. The weight loss and water-uptake properties of the bionanocomposite scaffolds were studiedin vitro. Anin vitrocell cytotoxicity test was carried out using mouse fibroblast (L929) cells cultured onto the scaffolds. Using a freezing and lyophilization technique, it was possible to fabricate three-dimensional, highly porous, and interconnected PEDOT:PSS/nHA/CS scaffolds with good handling properties. The porosity was 74% and the scaffold’s conductivity was9.72±0.78μS. The surface roughness was increased with the incorporation of nHA and PEDOT:PSS into the CS scaffold. The compressive mechanical properties increased significantly with the incorporation of nHA but did not change significantly with the incorporation of PEDOT:PSS. The PEDOT:PSS-containing nHA/CS scaffold exhibited significantly higher cell attachment. The PEDOT:PSS/nHA/CS scaffold could be a potential bionanocomposite conductive scaffold for tissue engineering.

Funder

Ministry of Higher Education, Malaysia

Publisher

Hindawi Limited

Subject

General Materials Science

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