Development and Analysis of Double-Faced Radial and Cluster-Arranged CMP Diamond Disk

Abstract

In semiconductor manufacturing, diamond disks are indispensable for dressing chemical mechanical polishing (CMP) pads. Recently, 450 mm (18 inch) diameter wafers have been used to improve output and reduce wafer production cost. To polish 450 mm diameter wafers, the diameter of polishing pads must be increased to 1050 mm. In particular, because diamond disks are limited to 100 mm diameters, a much greater number of working crystals will be required for dressing a 1050 mm diameter pad. Consequently, new diamond disks must be developed. In this study, novel arrangements are made using a braze in diamond patterns, which are radial with a cluster arrangement of 3-4 grits per cluster. Furthermore, a double-faced combined diamond disk is developed. The polishing pad surface was characterized, and the effect of different diamond conditioners on wafer removal rate was studied. This research aims to develop a more suitable diamond disk for dressing 1050 mm diameter polishing pads.