Post-Surface Processing and Virtual Simulation Analysis of Ball-Punch Test on CP-Ti Material

Author:

Vemula Ananda Mohan1ORCID,Chandra Mohan Reddy G.2,Manzoor Hussain M.3,Kumar Atul4,Kumar Naresh5,Allasi Haiter Lenin6ORCID

Affiliation:

1. Department of Mechanical Engineering, Guru Nanak Institutions Technical Campus, Hyderabad, Telangana, India

2. Department of Mechanical Engineering, Chaitanya Bharathi Institute of Technology, Hyderabad, Telangana, India

3. Department of Mechanical Engineering, Jawaharlal Nehru Technological University, Hyderabad, Telangana, India

4. SET, Mody University of Science and Technology, Laxmangarh-332311, Sikar, Rajasthan, India

5. Department of Mechanical Engineering, Manda Institute of Technology, Raisar, Bikaner, Rajasthan, India

6. Department of Mechanical Engineering, WOLLO University, Kombolcha Institute of Technology, Post Box No: 208, Kombolcha, Ethiopia

Abstract

The titanium alloy is one of the prime materials for many engineering applications. It has been recommended for the components in automotive engines, power sector, biomedical industries, and more applications. It is due to the unique properties of the material with good strength and corrosion resistance. However, it is very challenging to handle Ti-based materials in manufacturing sectors without damaging the metallurgical quality. Thus, an attempt made to study the deformability of the CP-Ti material through ball–punch test to represent the stress, strain, and formability limit during mechanical loading and plastic deformation. The experiments are conducted following the ASTM E643 standards to study the material behavior. The maximum cupping reached to a height of 8.69 mm and got teared at the peak of doom. The separation has induced grain detachment due to tensile loading. The same condition is used to simulate with PAM STAMP™ software and 8.48 mm is the maximum cupping height achieved. The different is 0.21 mm. The results are interesting with similar observations and found acceptable to study the deformation.

Publisher

Hindawi Limited

Subject

General Engineering,General Materials Science

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