Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn

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Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

Published:1987-12 Issue:12 Volume:3 Page:1040-1045
ISSN:0267-0836
Container-title:Materials Science and Technology
language:en
Short-container-title:Materials Science and Technology

Author:

Carroll M. A.,Warwick M. E.

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1179/mst.1987.3.12.1040

Reference22 articles.

1. Surface tension and density of liquid tin-lead solder alloys

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Measurement principles for room temperature liquid and fusible metals’ surface tension;Surfaces and Interfaces;2023-07

2. Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic-aided laser reflow soldering;International Journal of Modern Physics B;2021-02-02

3. Microstructure development, phase reaction characteristics and properties of quaternary Zn-0.5Al-0.5Mg-xBi hot dipped coating alloy under slow and fast cooling rates;Surface and Coatings Technology;2017-04

4. Synthesis of Sn nanoparticles and their size effect on the melting point;Microsystem Technologies;2014-12-21

5. Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders;Journal of Electronic Materials;2014-11-01

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