Microstructure and friction performance of copper film fabricated by ion implantation assisted electroless plating on PTFE
Author:
Affiliation:
1. School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou 221116, China
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1179/1743284710Y.0000000027
Reference14 articles.
1. Catalytic properties of plate-type copper-based catalysts, for steam reforming of methanol, on an aluminum plate prepared by electroless plating
2. Selective seeding of copper films on polyimide-patterned silicon substrate, using ion implantation
3. A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation
4. Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper
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