Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743284713Y.0000000287
Reference18 articles.
1. Hwang JS: ‘Implementing lead-free electronics’, 1–40; 2005, New York, McGraw-Hill.
2. Electrical Contacts
3. Sweatman K, Suenaga S, Nishimura T: Proceedings Pan Pacific, 127–133; 2008, SMTA.
4. Recent advances on Sn–Cu solders with alloying elements: review
5. Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In
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