1. J. H. Lau: ‘Ball grid array technology’; 1995, New York, McGraw-Hill.
2. K. Gilleo: ‘Area array package handbook’; 2002, New York, McGraw-Hill.
3. J. H. Lau: ‘Low cost flip chip technologies for DCA. WLCSP, and PBGA assemblies’; 2000, New York, McGraw-Hill.
4. J. H. Lau: ‘Flip chip technologies’; 1995, New York, McGraw- Hill.
5. J. H. Lau and Y. H. Pao: ‘Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies’; 1997, New York, McGraw-Hill.