Residual stress and nanomechanical properties of sonoelectrodeposited Cu films
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743294411Y.0000000011
Reference29 articles.
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2. Very Thin Poly-SiC Films for Micro/Nano Devices
3. Hoffman RW:in‘Physics of thin films’(, Hass G, et al.), 211–273; 1966, New York, Academic.
4. Residual stresses in the elastoplastic multilayer thin film structures: The cases of Si/Al bilayer and Si/Al/SiO2 trilayer structures
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