New electroless copper plating bath using sodium hypophosphite as reductant
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/1743294411Y.0000000049
Reference22 articles.
1. Copper Electroless Plating at Selected Areas on Aluminum with Pulsed Nd‐YAG Laser
2. Copper film formation using electron cyclotron resonance plasma sputtering and reflow method
3. Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS)
4. THE EFFECTS OF HF/PdCl2 ACTIVATION ON ELECTROLESS COPPER FILM PROPERTIES
5. The Deposition Characteristics of Accelerated Nonformaldehyde Electroless Copper Plating
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