Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components-Reference-Cited by-同舟云学术

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Published:2013-09 Issue:6 Volume:48 Page:426-435
ISSN:1478-422X
Container-title:Corrosion Engineering, Science and Technology
language:en
Short-container-title:Corrosion Engineering, Science and Technology

Author:

Verdingovas V.,Jellesen M. S.,Ambat R.

Publisher

Informa UK Limited

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1179/1743278213Y.0000000078

Reference29 articles.

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2. Hienonen R. and Lahtinen R. ‘Corrosion and climatic effects in electronics’, Vtt Publications, 2007.

3. Schweigart H. ‘Humidity and pollution effects on electronic equipment’, CEEES Publication, 2001.

4. Failure of electronic devices due to condensation

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