Electrochemical migration and dendrite growth between two electrodes: Experiments and Brownian dynamics simulations

Author:

Ható ZoltánORCID,Horváth BarnabásORCID,Guba SándorORCID,Tóth Zsolt,Kocsis Eszter,Boda DezsőORCID,Szalai István

Funder

National Research Development and Innovation Office

Publisher

Elsevier BV

Reference18 articles.

1. Electrochemical migration behavior on fr-4 printed circuit board with different surface finishes;Song;J. Electron. Mater.,2023

2. Electrochemical migration tests of solder alloys in pure water;Takemoto;Corros. Sci.,1997

3. Electrochemical migration failure mechanism and dendrite composition characteristics of Sn96.5Ag3.0Cu0.5 alloy in thin electrolyte films;Yi;J. Mater. Sci.: Mater. Electron.,2019

4. Fractal description of dendrite growth during electrochemical migration;Dominkovics;Microelectron. Reliab.,2008

5. Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components;Verdingovas;Corros. Eng. Sci. Technol.,2013

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