Electroforming of copper by the periodic reversal process-Reference-Cited by-同舟云学术

Electroforming of copper by the periodic reversal process

Published:2005-06 Issue:3 Volume:21 Page:204-208
ISSN:0267-0844
Container-title:Surface Engineering
language:en
Short-container-title:Surface Engineering

Author:

Ram Sankar P.,Khattak B. Q.,Jain A. K.,Kaul R.,Ganesh P.,Nath A. K.,Tiwari P.,Amban A.,Pagare A.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/174329405X50028

Reference10 articles.

1. Electroforming

2. H. Ino, K. Tajiri, Z. Kabeya, T. Nakamura, T. Kato, E. Takasaki and Y. Yamazaki: in ‘Proc. XX Int. Linac Conference’, (ed. S. C. Bapnaet al.), 1015-1017; 2000, New Delhi, Allied Publishers.

3. P. Ram sankar, B. Q. Khattak, A. P. Singh, S. K. Sharma, M. B. Kadam, C. Manikandan, C. R. Singh and S. N. Vyas: in ‘Proc. DAE-BRNS Indian Particle Accelerator Conference’, 723–725; 2003, Indore, India.

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