A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance-Reference-Cited by-同舟云学术

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A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

Published:2022-12-19 Issue:7-8 Volume:124 Page:2863-2875
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Zhang Yan,Deng Xinhao,Wu Chuandong,Han Guofeng,Zhang Jie

Funder

Six Talent Peaks Project in Jiangsu Province

State Key Lab of Digital Manufacturing Equipment and Technology

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-022-10644-y.pdf

Reference27 articles.

1. Liao Q, Li W, Liu H, Zhu L (2010) Fabrication of nanostructured electroforming copper layer by means of an ultrasonic-assisted mechanical treatment. Chin J Aeronaut 23(5):599–603. https://doi.org/10.1016/s1000-9361(09)60260-0

2. Ren J, Zhu Z, Zhu D (2016) Effects of process parameters on mechanical properties of abrasive-assisted electroformed nickel. Chin J Aeronaut 29(4):1096–1102. https://doi.org/10.1016/j.cja.2016.05.001

3. Zhang H, Zhang N, Fang F (2021) Study of ion transportation and electrodeposition under hybrid agitation for electroforming of variable aspect ratios micro structures. Precis Eng 72:122–143. https://doi.org/10.1016/j.precisioneng.2021.04.008

4. Chen YL, Wang Y, Wang Y, Ju BF (2021) Meniscus-confined electrodeposition of metallic microstructures with in-process monitoring of surface qualities. Precis Eng 70:34–43. https://doi.org/10.1016/j.precisioneng.2021.01.011

5. Daryadel S, Minary-Jolandan M (2020) Thermal stability of microscale additively manufactured copper using pulsed electrodeposition. Mater Lett 280:1258584. https://doi.org/10.1016/j.matlet.2020.128584

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