Numerical simulation of thermal conductivity of MMCs: effect of thermal interface resistance
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/026708303225004305
Reference21 articles.
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2. Materials for thermal conduction
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4. Equivalent inclusion method for steady state heat conduction in composites
5. Effective conductivities of aligned spheroid dispersions estimated by an equivalent inclusion model
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