Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174329304X8702
Reference11 articles.
1. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
2. Modeling of base metal dissolution behavior during transient liquid-phase brazing
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